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PHONEFIX 120X Pre-Heating Station for IPhone BGA CPU Desoldering Size:120CC china phone SK Hynix

USD45.55 USD79.55

Pay in 4 interest-free payments of $11.39 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Sep 15 - Sep 20

Pavilion notes

Duotone board — mint brief on the left, coral-folded detail sheet on the right.

Detail sheet
Description

china phone SK Hynix

P8 LITE SMART

Fast USB 3

3% of reading+10mA)

the Infrared Thermal Image Analyzer can test your cell phone main board

PHONEFIX 120X Pre-Heating Station for IPhone BGA CPU Desoldering Size:120CC china phone SK HynixPHONEFIX Heating Station + 3 kinds Motherboard Heating groove Features : Brand: PHONEFIX Voltage: 110V 220V Demolition shield temperature adjustment 180 220 In addition to CPU side glue temperature 180 220 Demolition A8 A9 A10 A11CPU the temperature 230 240 Desmearing temperature 180 200 Reballing BGA chip temperature 180 200 Soldering A8 A9 A10 A11 CPU temperature 190 210 Optional Types : 120X MAX ( 3 IN 1 ) for iPhone X XS XS MAX Double Layers Board

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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