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Amaoe BGA Reballing Stencil For Huawei CPU RAM WIFI IC HW1-HW19 phone other accessories can effectively protect the computer

USD34.99 USD68.99

Pay in 4 interest-free payments of $8.75 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Sep 15 - Sep 20

Pavilion notes

Duotone board — mint brief on the left, coral-folded detail sheet on the right.

Detail sheet
Description

can effectively protect the computer motherboard

the real meaning

Power: 120W

such as SOIC CHIP QFP PLCC and BGA etc (especially for flat cables and cable connectors)

1x iPhone 12 Pro Max mold

Amaoe BGA Reballing Stencil For Huawei CPU RAM WIFI IC HW1-HW19 phone other accessories can effectively protect the computerAmaoe 0. 12mm BGA reballing stencil HW1 HW2 HW3 HW4 HW5 HW6 HW7 HW8 HW9 HW10 HW11 HW12 HW13 HW14 HW15 HW16 HW17 HW18 HW19 for Huawei CPU RAM WIFI IC soldering repair. Amaoe BGA Reballing Stencil steel mesh for huawei Honor Mate Nova Enjoy Maimang series. Option: HW: 1: Kirin 930 935 HI3630 3635 CPU, for Huawei P8, Mate7 MTS, Honor 7 X2, ect. HW: 2: MSM8916 8939 MT6753V CPU, for Huawei G7 G8X 5S, Honor 7i Play 5X, ect. HW: 3: Kirin 950 955 HI3650 CPU,

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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