WDS-700 BGA desoldering Rework Station for circuit boards repair Oscilloscope PPD 120CXE Mini Intelligent Desoldering

PPD 120CXE Mini Intelligent Desoldering Rework Station for Remove Welding iPhone X CPU Repair

Output state memory function

(Steps 1 - 2 - 5)

Simple per-partition operations (Read

Box fully supports 4-bit transmissions and allows you to read up to 52 MHz bus width

WDS-700 BGA desoldering Rework Station for circuit boards repair Oscilloscope PPD 120CXE Mini Intelligent DesolderingOptical alignment system BGA rework station WDS 700. WDS 700 BGA Rework Station are widely used to replace and repair the BGA chip in laptop, mobile phone, The main user is repairing shops and factory to provide the after sales service and rework. How to separate BGA chip from motherboard How to replace a new BGA chip Repair steps : Separate the BGA chip from mother board we called desoldering Clean Pad Reballing or replace a new BGA chip directly